Study on Preparation and Polishing Performance of Ceria Slurry

In this paper, propionic acid, oxalic acid and phytic acid were used as pH regulators in wet grinding, respectively. Propionic acid was found as the best pH regulator according to the result of particle distribution and zeta potential. The ceria slurry was prepared for chemical mechanical polishing with average particle size (D50) of CeO
2
is 225.4 nm. With the ceria slurry prepared, the material removal rate (MRR) of SiO
2
as high as 403 nm/min; at meantime, the SiO
2
roughness is smaller than 0.10 nm (Ra, 0.02 nm).