FOWLP AiP for SOTM Applications

This paper presents a wideband dual-polarized Antenna-in-Package (AiP) element implemented in Fan-Out Wafer-Level-Packaging (FOWLP) technology for SATCOM On the Move (SOTM) beam steering applications. The AiP element features a meta-surface radiator and two sets of orthogonally arranged power divider aperture feed to achieve wideband performance and pure dual polarizations. By stacking a top mold of 300μm, a middle mold of 90μm and a 42μm RDL layer at the bottom, with a size of 6mm×6mm×0.442mm the AiP element achieves a Return Loss > 13.4dB, an Isolation > 20.6 dB, a Gain of 5.54-6.78dBi over the 27-31 GHz with pure H and V polarizations. The concept of circular polarized 2×2 AiP subarray with an embedded 8-channel beamformer chip and the method of further forming the scalable array are illustrated. The AiP thermal dissipation is also evaluated.