Kelvin Bridge Structure Based TSV Test for Weak Faults

Due to the immaturity of manufacturing process, TSV is vulnerable to a variety of defects, which brings new testing challenges. Most of the existing test methods are suffer from the test resolution and difficult to detect weak faults. Borrowing the wisdom of Kelvin Bridge, a non-invasive test method is proposed to detect resistive open fault and leakage fault. By adjusting the resistances on the bridge arm to make them change in equal proportion, the adverse effects of contact resistance and parasitic resistance on the wire can be eliminated. HSPICE simulation using 45 nm CMOS technology show that it can successfully detect resistive open fault above 0.1 $\Omega$ and leakage fault below 10 $ M\Omega$. The effectiveness of the test scheme is further proved by process-voltage-temperature (PVT) analysis.