Optimization of Placement of Elements on Printed Circuit Assembly According to Thermal Conditions Using Genetic Algorithm

Optimization of thermal modes of the printing unit is one of the main design tasks designed to improve the reliability and operational characteristics of an electronic device. When designing printed circuit assemblies, it is necessary to take into account many different parameters of the device being developed, including weight and size limitations, numerical values of dissipated capacities and operating temperatures of elements, characteristics of the materials from which they are made. The article presents an algorithm for solving the problem of ensuring thermal conditions in the design of an electronic device by finding a rational option for the placement of component elements. The implementation of this approach has become possible with the development of modern computer-aided design, modeling and engineering analysis tools that provide developers with a wide range of research tools. In addition, when developing the method, a combination of traditional algorithms for solving extreme problems and genetic algorithms for finding the best solution was used, allowing to fully take into account the totality of factors affecting the reliability of the designed device as a whole.