I. Introduction and Motivation
Today, as electronic products become small and powerful, the heat generated from power modules tends to accumulate inside devices, which is a common cause for damage and shortening of product lifespan. Fin-type heat sinks are well known to assist in dissipating the heat efficiently[1]. As such, the overarching goal of our study is to propose air-cooling fin-type heat sinks with enhanced cooling performance compared to the conventional air-cooling heat sink. The related work has studied the effect of geometries of channels[2],[3], yet the it remains unexplored what optimal fin geometry can contribute to design heatsinks achieving the utmost cooling performance.