POL tile as a small package for a power module

Recently, power devices market is growing rapidly. Power Overlay (POL) tile is remarkable package as a small package for a power module. Prototype Mold structured POL tile was demonstrated and compared with Under Filling structured POL tile. Reliability test were performed on Temperature Cycling test and Power Cycling test. Temperature cycling reliability of Mold type POL tile was higher than that of U.F. type POL tile. In the prototype structure, it was found that the change in Cu wiring design could improve the reliability of Cu via and achieve encapsulation resin crack resistivity at the same time.