Thermal Challenges for HPC 3DFabricTM Packages and Systems

With HPC devices continue to scale up for higher power and higher power density, thermal dissipation management for IC packages are becoming an important issue. This paper presents the thermal solution evolution at package level and system level, that drives towards more advanced package TIM1 solution and liquid or immersion cooling solution. Thermal-aware device floorplan, package thermal solution and advanced system cooling solution are critical to enable HPC application