Virtual Testing and Digital Twin Approaches for Response of Grain-scale Solder Interconnects to Multiaxial Loading

This work aims to implement a new modeling technique that does consider the grain structure of solder interconnects for simulation of material fatigue and damage at cyclic thermomechanical load. It is based on a continuum model for anisotropic steady-state creep that was recently developed at CALCE/ University of Maryland [1]-[2]. We will briefly recap the major steps that were taken to derive anisotropic Hill-Garofalo constitutive relations from a crystal-viscoplastic (CV) approach. The Hill-Garofalo model will be presented in detail and a simple benchmark model will be proposed. The benchmark model will then be applied for verification of finite element analysis (FEA) code implementation. FEA is then used to simulate a solder interconnect with explicitly modeled microstructure. Simulation results will be discussed, conclusions and suggested future work will be shared.