Determination of Rate- and Temperature Dependent Inelastic Material Data for Sintered Silver Die Attach and Simulative Implementation

The higher operating temperatures of power modules based on wide-bandgap semiconductors demand a better understanding and modeling of the viscoplastic material behavior of the die attach layer, in this case sintered silver (SAG). Within a physics-of-failure approach, the damage caused by viscoplastic and plastic deformation is crucial for the estimation of lifetime and reliability of the power modules. In this study, the viscoplastic Anand model and a newly proposed creep model for SAG will be presented, fitted to data from tensile tests and implemented in finite element simulation by means of a user-programmable feature. Subsequently, the simulational results will be compared.