Simulation optimization of Wire bonding line matching based on FDTD algorithm

In order to solve the serious impedance mismatch problem of the gold wire bonding line in millimeter wave microassembly process in 8mm band, this paper simulated and optimized the process of the gold wire bonding line based on FDTD algorithm. As the parasitic inductance and parasitic capacitance of the gold wire bond line increase sharply in 8mm band, the output impedance of the gold wire bond line is not 50Ω. At this time, the output impedance mismatch between the wire and chip is serious, and the transmission efficiency of the system is greatly reduced. In the 32ghZ-36ghz band, the echo loss of single chip bonding to microstrip transmission line is improved by 10-15dB after simulation optimization compensation. This improves the transmission efficiency of the system and has a good engineering application prospect.