Development of Temperature Rise Simulation APP for Three-phase Common Enclosure GIS/GIL

Thermal performance is one of the core properties of three-phase common enclosure GIL, which plays a decisive role in its structural size design and cost. The evaluation of GIL temperature rise performance involves complex electromagnetic-flow-thermal field coupling simulation, which has low modeling efficiency and great difficulty in use and brings difficulties to developers. Considering the skin effect, proximity effect, natural convection, radiation and other influencing factors, a three-phase common enclosure GIL temperature rise simulation model is established and invalidated by four testes. The results show that the maximum temperature rise error is 1.6K. The simulation results show that the skin effect and proximity effect increase the equivalent resistance and power loss of conductor by 33% compared with DC condition. Finally, a highly customized simulation APP is developed, in which users only need to input structural dimensions and material properties parameters so as to avoid the complex modeling process. The actual application results show that the APP can improve the efficiency of pre-processing and post-processing of simulation by more than 20 times and the overall efficiency by more than 10 times.