Research on High Speed and High Precision Control Method Used in Semiconductor Packaging System

In the integrated circuit manufacturing, the chip packaging has high requirements for the response ability, positioning accuracy and positioning time of the motion control system, which requires the movement platform to move to the target position quickly, smoothly and accurately in a very short time, therefore, servo control strategy is the core difficulty of chip package control system. This paper proposes a new improvement algorithm focuses on solving the control technical problem according to the high speed, high acceleration and high precision motion requirements of semiconductor packaging equipment on the basis of traditional PID control. Firstly, the system is based on the PID/PI/PI control position ring, speed ring and current ring, then the control system uses linear motor, current ring and speed ring as a control whole to add acceleration and speed feedforward to improve the system response ability and to add a specific interference observer to improve the suppression ability of internal interference and external interference, thus realizing the rapid and precise positioning control of semiconductor packaging equipment at high acceleration and high speed. Experimental validation shows that the tracking error of X axis is improved from 12 micron to 1.2 micron, positioning time is improved from 100ms to 10ms, positioning accuracy is improved from 60 micron to 5 micron, the Y axis is also improved as the same as X axis. The algorithm meets the motion requirements of the semiconductor packaging equipment control system, and its processing effect fully meets the requirements.