Simulation Studies on Packaging of Piezo MEMS Acoustic Sensor for Underwater Applications

Demand for miniature hydrophone sensors is ever increasing due to the advent of smart miniature autonomous underwater vehicles. Piezo micro-electro-mechanical system (MEMS) based devices are being reported for acoustic sensing applications. In this work, stainless steel (SS) and fibre reinforced plastics (FRP) materials are used as the packaging base for the piezo MEMS structure. Analysis of Transducers by Integrating Laplace equations (ATILA) and GiD are used to perform the analysis of the packaged device and receiving sensitivities for different dimensions of the piezo MEMS. The effect of materials and their thickness are simulated and reported.