Silicon Photonics Technology for Terabit-scale Optical I/O (Invited)

Summary form only given, as follows. The complete presentation was not made available for publication as part of the conference proceedings. We discuss imec's Silicon Photonics interposer technology targeting Tb/s/mm2-scale Optical I/O interconnects for next-generation datacenter network switches and HPC/AI systems. We will cover recent progress in active photonic components, including high-speed Si ring modulators and GeSi electroabsorption modulators. We will also discuss the integration of high-speed Through-Si Via's (TSV) implemented in this platform, and illustrate how flip-chip integration with FinFET CMOS through Cu micro-bumps can enable ultra-low power Tb/s/mm2 transceivers.