A method for increasing the reliability of obtaining holes in printed circuit boards

It is noted that the reliability of equipment using elements of automated control and programming largely depends on the operability of the essential aspects of electronics, namely the printed circuit board. At the same time, the fault tolerance of the printed circuit board largely depends on the quality of the implementation of transversal connections. The conducted studies have shown that the initial factor affecting the quality of such compounds is the process of hole formation in composite materials. The primary technological technique for obtaining holes is drilling. At the same time, it is difficult to control the process of all parameters and drilling modes to prevent the appearance of defects in these operations, especially in conditions of small hole diameters and the speed of drilling the hole. An essential feature of such control is the random nature of the process being carried out, which is associated with the random distribution of the fiberglass hardness areas. However, theoretical studies have shown that the integral indicator affecting the quality of the hole is the temperature in the cutting zone of fiberglass. Direct measurement of this temperature is almost impossible. However, an indirect way to estimate the temperature is to measure the feed force in each drilling cycle. Based on the stated and experimentally confirmed prerequisites, hardware, and software complex of the active process of drilling holes in printed circuit boards has been developed. The practical use of the complex showed its effectiveness and made it possible to reduce the percentage of defects in the production of printed circuit boards by 10%.