DDR RF Interference in Fan-less SoC Design

This paper presents the RFI studies done on LPDDR5 memory interface and its impacts to WiFi bands at 2.4GHz and 5-7GHz for <10W TDP fan-less with thermal spreader, mobile platform design. With the passive thermal solution, the system has become more susceptible to RFI noise and the increased trend in memory data rate has further increased the radiation risks and design complexity as well. So, more detailed evaluations need to be done to correctly mimic the actual memory signals operating conditions and capture the right responses for analyses. Three test cases were studied, and the RFI performance were measured against the narrowband and broadband limits.