Analysis of the Influence of Vibration and Thermal Vibration Coupling on the Power Module

This paper uses finite element simulation to study the influence of the area, thickness and material of the substrate on the solder layer of the power module under a random vibration environment. The results show that when the area of the substrate increases, the thickness decreases, and the density increases, the stress of the solder layer increases and it is more prone to failure. In addition, the influence of random vibration on the power module is studied under the premise of thermal load. It is found that the thermal load will make the influence of random vibration on the solder layer smaller.