Thermal Simulation of Processing-in-Memory Devices using HotSpot 7.0

3D Integrated Circuits (3D ICs) offer many advantages over their 2D counterparts, such as increased bandwidth and energy efficiency, that has lead to the popularity of commercial products such as HBM and HMC. However, they also have well-known thermal challenges that need to be resolved before they can be integrated with high performance processors or Processing in Memory (PIM). Microfluidic cooling is a promising solution to these thermal challenges, but its associated design space is large enough and complex enough that we need a design space exploration tool. We extend HotSpot, an existing thermal simulator, to support flexible modeling and simulation of microfluidic cooling designs. We believe this tool will enable research into novel microfluidic cooling techniques, ultimately resulting in higher performance 3D ICs with reduced thermal constraints.