I. Introduction
The high efficiency antenna plays an important role in compact and cost-effective millimeter-wave systems [1]–[6]. So far, significant progress has been made in the development of millimeter-wave communication and image systems based on the antenna-in-package (AiP) solution due to its small size, wide impedance bandwidth and high data rate. For example, an antenna-in-package phased array has been used for 60 GHz communication systems using the low-temperature co-fired ceramic (LTCC) technology [7]–[8] and the multilayer organic-substrate technology [9]–[10]. It also uses the embedded wafer level ball grid array (eWLB) technology in a phased array for 60 GHz radar system [11].