A 4-Element Ka-band Phased Array Transmitting Module based on 3D Packaging

The paper presents the design of a novel Ka-band transmitting module by utilizing 3D packaging technology. The proposed module consists of switch, phase shifter, RF power amplification, power supply management and antenna element. The design features the advantages of compact size and good performance. A 4-element transmitting module is integrated on 14mm×14mm×3.2mm. Each transmitter element provides 22.8 dBm of minimum output power on 25GHz~27.5GHz. The array achieves 360 degree of phase shifting range with phase resolution of 6 bits.