Research on Broadband RF Signal Transmission Structure Applied in 3D SIP

With the increase in integration density, 3D SIP technology has become an important solution for high-density circuit integration. In the three-dimensional stacked package, the broadband radio frequency signal transmission structure will affect the performance of radio frequency signal cross-layer transmission, and has an important impact on the performance of radio frequency components. Starting from the requirements of broadband 3D SIP technology, based on microwave transmission theory, using electromagnetic field simulation tools to simulate and verify a variety of RF signal transmission structures, a broadband RF signal transmission structure based on BGA technology combined with multiple horizontal transmission and vertical transition structures is realized. The test results show that at 18 GHz, the insertion loss of the SICL transmission line in the HTCC ceramic board is only 0.03 dB/mm, and the isolation between the two transmission lines is better than 60 dB.