A new 3D X-ray solution for non-destructive construction analysis of advanced electronics packages

Over the last decade, 3D X-ray has become essential for non-destructive construction analysis of semiconductor packages [1]–[6]. This analysis is often done by skilled technicians using advanced X-ray systems. A recent trend in advanced IC package solutions is for a significant increase in 3D complexity and interconnect density [7]–[9]. These advanced package solutions are pushing the detection capabilities of existing X-ray systems, as well the analytical capabilities of the technicians who interpret the results [10]–[11]. In order to keep-up with industry requirements, an X-ray solution is developed to break through these performance barriers. In this article a new semi-automated workflow for 3D measurement of sub-surface interconnects in complex 3D IC packages will be described. This workflow is based on newly developed X-ray hardware and a semi-automated data analytics system which extracts actionable data from package interconnects. A commercial 3D DRAM package will be analyzed using the proposed workflow and data will be extracted which would be difficult or impractical to obtain using legacy methodologies, whether destructive or not. The reliability and repeatability of the proposed workflow will be tested and validated on multiple samples by measuring the critical dimensions repeatedly over a six-month period.