Error tolerance analysis and multipaction suppression of micromachined E-band duplexer

This work demonstrates the design of an E-band waveguide duplexer and the fabrication process based on micromachining technology. To make the proposed solution practical, the error tolerance analysis and multipactor effect simulation were carried out. Compared with state-of-art technologies, three distinctive advancements have been achieved: (1) the design of a high-performance E-band duplexer and the corresponding fabrication process based on micromachining technology; (2) the demonstration of the RF performance simulation and the error tolerance analysis of the proposed fabrication process; and (3) the illustration of the multipaction phenomena and the counter measures to inhibit the effect. As such, the proposed portfolio of micromachining fabrication process and suppression scheme of multipaction can offer a practical approach for E-band waveguide duplexers.