Study on wettability of copper alloy by pulse electrolytic machining

The electrolytic polishing of copper alloy was carried out by pulse electrochemical machining (PECM) technology, and the effects of voltage and processing time of pulse electrochemical machining on the surface wettability of copper alloy were investigated by single factor experiment. The microstructure of the workpiece was characterized by scanning electron microscope, and the element composition was analyzed by x-ray diffractometer. The results show that when the voltage is 8 V and the processing time is 30 s, the number of micro-nano structure on the workpiece surface is moderate, and the machining effect is the best, which affects the contact state of the surface, and the contact angle is 138.6°. The processing technology is efficient, rapid, and environmentally friendly, can be processed at one time, and the preparation of microstructure on the surface of copper alloy has important industrial significance.