Effect of Cable-bend on CISPR25 CE Current Method

Conducted Emissions (CE) contributes to a significant percentage of compliance failures in the verification stage of electronic hardware. In this work, the effect of cable-bend on the CE results is studied. The cable bend at the LISN-end can affect the common mode impedance due to the change in the mutual coupling between the cables. A full-system hybrid-solver capability is implemented based on the observations. The cable bend effect is demonstrated using the simulation setup comprising of LISN, cable harness and D UT. The effect is further validated using measurements.