Research on Thermal Characteristics of High Power 3D Microchannel Multichip Package

In order to solve the heat dissipation problem of the high-power three-dimensional System in Package (3D-SiP), the Fractal Theory is applied to optimize the design of microchannel structure to get better thermal characteristics. The effects of microchannel spacing (W), cross-sectional width (L) and length (H) to heat dissipation are optimized with an orthogonal experiment. Then the optimum parameters are obtained by orthogonal test at the W 40 µm, L 40 µm and H 300 J.1m. Three types of microchannel structures, microchannel heat sink with parallel fin (MPF), micro channel heat sink with staggered fin (MSF) and micro channel heat sink with embedded fin (MEF), are designed and studied on thermal characteristics by ANSYS ICEPAK module. The simulation results show the temperature of MPF, MSF and MEF is lower than that of a conventional microchannel heat sink (CM) by 1.0 °C, 0.8 °C and 1.7 °C. Compared with the others, MEF could get the best heat dissipation which provides a reference for the design of high power 3D-SiP heat dissipation.