The Influence and Optimization of Design Parameters on Integrated Circuits Package Warpage

As an important factor affecting the reliability of integrated circuits (IC), warpage has attracted more and more attention. This article uses a combination of theoretical analysis and experimental verification. First, finite element method is used to analyze the impact of IC packaging materials on product warpage, and secondly, the simulation results are verified through experiments. The research results show that for smiling face products, reducing the Coefficient of Thermal Expansion (CTE) of the Epoxy Molding Compound (EMC) and increasing the CTE of the Core can effectively reduce product warpage. At the same time, reducing the thickness of the Core and increasing the thickness of the soldermask (SM) are also conducive to reducing warpage; for crying face products, the opposite is true. The above research results provide a theoretical basis for reducing product warpage in IC packaging.