Simulation Analysis of Residual Stress of Sintered Nano-Silver under Multilayer Stacked Module

In this paper, the residual stress of the multi-layer stacking structure is analyzed, the material selection of different layers is discussed, and the optimization scheme is given. The finite element analysis (FEA) software ANSYS is used for calculation and analysis, the ANAND constitutive model is adopted to describe the visco-plastic behavior of AU
80
Sn
20
and sintered nano-silver, the bilinear isotropic hardening is adopted to describe the plastic deformation of materials, and the thermal-mechanical coupling is used to realize the multi-scale coupling between the soldering layer and other function layers. It was found that the maximum deformation is concentrated at the edge of each layer and the residual stress is much serious with the AU
80
Sn
20
compared with the sintered nano-silver.