Thermal Analysis of High-Power Light-Emitting Diode Using Thermoreflectance Thermography

High temperature has a serious impact on the reliability and optical properties of high-power light-emitting diodes. It is of great significance to obtain the transient thermal distribution and peak temperature of high-power LED devices during operation for component testing, design, and structure optimization. Thermal microscopic imaging based on visible light and thermoreflectance has not only high temporal-spatial resolution, but also high temperature resolution. Therefore, this technology can be used in thermal measurement of precision semiconductor devices. In this paper, we proposed a timing control scheme for separating electroluminescence and thermal signals, measured the transient thermal distribution and peak temperature of high-power light-emitting diode devices by using a thermal microscopy imaging device based on visible light and thermoreflectance, verified the feasibility of the proposed method in thermal distribution characterization and material defect diagnosis of high-power LED devices.