Effect of IMC morphology on the current density and temperature gradient of line-type Cu/Sn/Cu solder joint

With the development of miniaturization and multifunction of electronic package, the reliability problem of electromigration (EM) and thermomigration (TM) in interconnect solder joints has been prevailing. The purpose in the present study is to probe into the impact of intermetallic compound (IMC) on morphology electromigration and thermomigration, the finite element (FE) model was used to analyze electromigration and thermomigration behavior under different IMC layer morphology and loading conditions in this study. The results indicate the current density has little correlation with the morphology of the IMC layer, while the IMC thickness has a slight influence on the temperature gradient. In addition, the values of the maximum and the minimum current density appear on the sunken zone and projection parts of IMC layer, respectively. With regard to temperature gradient, the maximum temperature gradient and minimum temperature gradient are located at the solder and the IMC layer, respectively. the temperature difference can lead to large temperature gradients.