3-D Finite Element Modeling of Nanoindentation on Sn-3.5Ag Lead-Free Solder

The continuous search for richer and simpler characterization method leads to the use of 3-D finite element method to complement and visualize the Berkovich nano-indentation on the Sn3.5Ag solder as a mean to characterize their mechanical properties. This modelling-simulation study correlated with our earlier experimental nano-indentation study published elsewhere [1]. P-h curve extracted from physical testing matched the finite element analysis technique obtained from the Abaqus standard solver in this current work. Quasi-static analysis with nonlinear contact mechanism between the indenter and specimen was evaluated based on the rigid indenter and deformable Sn-3.5 Ag solder based on the Dao's method. This 3D modelling allowed the Berkovich indentation to be visualized with contours like Von Mises stress, PEEQ strain, and deformation plot, thus enabling a detailed investigation of the nano-indentation process. This model proves to be useful for similar elastic-plastic soft materials encountered elsewhere in micro-electronics applications.