Influence of Fiber Diameters on the Thermal Conductivity of Liquid Crystal Epoxy Resin Film

The intrinsic low thermal conductivity of epoxy resin limits its application in the field of high voltage insulation. At present, electrical equipment is developing in the direction of UHV and large capacity. The heat per unit volume of the equipment increases sharply, which causes the epoxy resin to age prematurely and reduces the life of insulating materials. Therefore, there is an urgent need to improve the thermal conductivity of epoxy resin insulating materials. In this paper, electrospinning is used to prepare the liquid crystal epoxy resin nanofilm. The material was analyzed from the perspectives of surface morphology and thermal conductivity. The influence of the diameter of the liquid crystal epoxy resin fiber on the thermal conductivity of the film was analyzed. Results show that the thinner the diameter of the fiber film is, the higher the orientationdegree. With the decrease of fiber diameter, the in-plane thermal conductivity increases, but the out-of-plane thermal conductivity decreases. The maximum in-plane thermal conductivity can reach 0.351 W/(m·K), while the out-of-plane thermal conductivity is only 0.114 W/(m ·K).