Investigation of an Integrated Directional Coupler Manufactured by a Field-Assisted Diffusion Process

An integrated directional couplers manufactured in thin glass sheets by a field-assisted diffusion process is analyzed. The Coupler is designed for a simultaneous bidirectional chip-to-chip intercommunication in Electro-Optical Printed Circuit Boards (EOPCBs). A numerical investigation to optimize the designed coupler efficiency is presented using a geometrical optics algorithm. The results are verified by measurements to achieve an optimal coupler structure.