Printed flexible LC filter using the micro-dispensing technique using silver conductive pasted and ECA for component attachment

Conventional rigid PCBs have been used in a variety of applications and have grown over the years to be the most reliable for the electronics industry. The rigid PCBs consist of thousands of surface-mounted devices that are attached to the circuitry using solder and traces. As far as flexible electronics is concerned, there has been not much study of the device attachment processes. Flexible substrates providing a higher degree of freedom, thus being very important to develop a reliable method for connecting components to circuits that can accommodate the various movements. In this paper, a micro dispensing device is used to print conductive traces and electrically conductive adhesive (ECA) pads for attachment of components. The effect of different print parameters on the width and height of the trace has been studied. Mechanical and electrical properties also play an important role in the study of different sintering conditions. Optimized parameters from the printing process and sintering analysis are used to print and compare commercially available LC filter circuitry using the Bode plot.