Investigating the Influence of an Electronic Device’ Properties on Its Temperature Regime

In this study is investigated the influence of different constructional and environmental parameters of a PCB with SMD components on its thermal regime. The dependent variables are the temperature of the PCB and the temperature of the device' box. The simulation was conducted for the following independent variables: the input power, the temperature of the environment, the height of the PCB coating and the cross-section of the mounting area between the PCB and the box. Furthermore, several scenarios with different parameters of the filling resin were investigated as well as the influence of the material of the box. The obtained results showed that the diameter of the mounting areas could have an impact on the PCB temperature, while the coating height is insignificant. Furthermore, using additional one-sided silicon filling provided a very significant drop in the PCB temperature. Similar results were obtained when using metal box.