Lamination of dry film epoxy molding compounds for 3D packaging: advances and challenges

We report recent advances in the processing of dry film Epoxy Molding Compounds (EMCs) through two technologies: lamination under vacuum and compression molding. From the perspective of 3D packaging, particularly for Fan-Out Wafer-Level Packaging (FO-WLP) technology, the main advantage of using dry film is to achieve both under-filling and over-molding steps at the same time. Two main challenges are addressed: under-filling of relatively small dimensions (up to 10µm) and the minimization of the warpage inherent to the EMC use.