Enabling low loss thin glass solutions for 5G / mmWave applications

In this paper, we describe progress in via-formation and processing of thin glass substrates. An advanced temporary bonding approach enables easy handling of thin glass substrates through TGV fill, as well as aggressive downstream processes such as CMP. The formation of TGVs in both aluminoborosilicate and fused silica is discussed, and hermetic, filled vias are successfully demonstrated. Promising simulation results on fused silica validate the usefulness of glass structures in millimeter-wave-frequency antennas.