1 µm Diameter high Aspect Ratio via Formation on RDL Dielectric by Imprinting Technology\ \mu m$ diameter high aspect ratio via formation on RDL dielectric by imprinting technology

We have developed a thermosetting insulation material to fabricate small via below
$\mathrm{2}\ \mu\mathrm{m}$
by imprinting technique. It was necessary to increase the curing rate in order to form via. Both small via below
$\mathrm{2}\ \mu\mathrm{m}$
and low CTE(coefficient of thermal expansion) below 50 ppm/°C properties are achieved by optimization of filler size.