High performance FCBGA Package Evaluation and Characterization for the Networking Application

In order to enable higher electrical performance for the application of networking, larger FCBGA package was been demanded to meet the electrical target. According to that, the package size has been developed from 60mm×60mm to 100mm×100mm and die size has been larger than 25mm×25mm in advance networking application. Normally, larger FCBGA package would result in increased semiconductor assembly processes and reliability challenges, such as die corner delam, solder mask crack, ELK crack and warpage issue. This paper will provide the optimal solution for the assembly processes and reliability challenges. One is Molded type FCBGA package which would be a solution to reduce processes and reliability risk. Several Molded type FCBGA packages were proposed in this paper to check the level of stress and warpage performance compared to traditional EHS-FCBGA package. Others will focus on traditional EHS-FCBGA to provide the optimal solutions to solve reliability issue including die thickness effect, underfill material selection, solder mask material suggestion, reflow profile effect, die bonding process MR(Multi-reflow) and LAB(Laser Assisted Bond) effect and substrate compensation. According lots fundamental work, molded type FCBGA package could reduce package stress effectively and perform similar warpage with traditional EHS-FCBGA to be a solution. Besides molded type FCBGA, this paper also would provide optimal structure and material suggestion for traditional EHS-FCBGA.