Develpoment of Leadframe for Quad Flat No-Lead Package

In this article, we discuss the influence of the lead frame design on the amount of deformation with the view of enhancing the quad flat no-leads (QFN) package reliability. Our study commenced with designing two types of the lead frame which were assessed using a simulation model based on finite element analysis. The aim was to determine the differences in the performance of the two designs based on simulated temperature distribution and deformation after thermal expansion during heating. The simulation results show that the lead frame design with release holes exhibits less deformation, and that the 12-row lead frame design is more reliable than that based on 6-row lead frame.