I. Introduction and Motivation
The miniaturization of the power modules causes severe thermal problems. Therefore demand of high cooling system has been increasing. Heatsink is one of the important components in power electronics systems. This function is to release heat. The conventional heatsinks have simple shapes because of the ease of manufacturing. In ICEP2019, we proposed a spiral-fin heatsink that has complex shape and higher cooling performance than conventional heatsinks. However, previous work did not fully verify the optimal parameters. In this work, the relationship between each parameters and the cooling performance is verified.