Mechanical Reliability Analysis of Dual Side Molding SiP Module

With the advent of the 5G era, the advanced package structural System-in-Package (SiP) is widely applied in consumer electronics. It can combine more and more heterogeneous components such as RF front-end module, WiFi module for coming 5G application. Compared with typical single side SiP module, the advanced dual side SiP which used double side Surface Mount Technology (SMT) and molding structure to reduce module size and increase components effectively. In this work, a 7 × 7 mm
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dual side molding (DSM) module package with thermal solution structure was chosen to analyze reliability performance. Finite element method (FEM) was firstly constructed and experimentally benchmarked for board level reliability tests including drop and thermal cyclic tests. The results indicate that DSM SiP structure with thermal solution improves junction temperature and thermal resistance. Besides, board level mechanical reliability was eventually enhanced by new DSM thermal solution structure. It can be a new type DSM SiP package for the future 5G application.