Performance Evaluation Of Via-free Non-spiral Planar Microcoils for Biomedical Wireless Links

This paper presents a finite element analysis of a non-spiral planar microcoil based biomedical wireless power link. Non-spiral planar microcoils provide distinct advantages over the conventional microcoils concerning fabrication easiness and heating losses. Microfabrication of non-spiral planar microcoils requires only a single metal level lithography. Optimum geometry of coils for realizing wireless link is selected as a circular one. The coupling factor of wireless links making use of such coplanar coils is found to reach up to 90% with an additional Neodymium magnetic shield layer by optimizing its position.