Low CTE Polyimide for Advanced Package Application

Coefficient of thermal expansion (CTE) mismatch is one key issue for the reliability of the dielectric materials in the advanced package. Herein, a novel polyimide (PI) with low CTE is successfully prepared with the introduce benzoxazole and silicon-oxygen groups. The CTE of PIs are well controlled and match that of copper. Besides, excellent thermal and mechanical properties are also proved. As a result, the PI possesses great potential as insulating materials in advanced package applications.