Low temperature curable polyimides for advanced package application

Polyimides (PIs) with excellent thermal, mechanical, dielectric properties have been widely employed as electronic package materials in integrated circuit industry. However, PI is imidized at high temperature (>350 °C) traditionally, which limits its application in thin-film transistor and fan-out wafer level package (FOWLP). In this work, 5-aminobenzimidazole is introduced as a curing catalyst to get a low temperature curable polyimide with good properties.