Synthesis of Microcontroller Control Device for Process Control of Electroplating Metal Deposition

The purpose of this work is to automate the technological process of copper electroplating on printed circuit boards.The necessity of this work is conditioned by considerable duration of technological process during which electrolyte composition changes and constant manual correction of current level between anode and cathode of the plant is required.The developed microcontroller device allows to expand possibilities of galvanic metallization plant:-performs current correction and its maintenance in the range of ± 1% of the set value;-displays the main parameters of the plant operation (current flow, operating time, mode);-has time-corrected cycles of forward and reverse polarity modes of output voltage for homogeneity of the layer being built up;-It fixes the main process parameters, which can be further processed on the PC.