mm-Wave Active Phased Array SiP Module for UE Devices in 5G Communications

In this paper, a mm-Wave phased array system in package (SiP) module is designed for user equipment (UE) in 5G communication where miniature designs and full coverage is desired. An 8-element endfire linear array, its feeding network and two mm-Wave phased array integrated circuits (IC) are integrated and co-designed within an 18 × 14 × 0.575mm
³
ceramic package. This module is capable of steering ±45
⁰
in Azimuth and ±30
⁰
Elevation plane delivers 10dBi array gain over 5 GHz bandwidth. With four such modules a cellular device could achieve full coverage enabling high data throughput. This proposed phased array SiP design is a good candidate for next generation mm-Wave high speed 5G UE.