Design and Fabrication of High Density 3D IPDs (Integrated Passive Devices) on Glass Substrate

A number of test structures for capacitors and inductors were designed and manufactured on glass substrate. The fabrication process of IPDs forming with TGVs, Si
₃
N
₄
layers and multilevel metal layers on glass wafer is presented in this paper. Three-dimensional full-wave electromagnetic field simulation tools were used to analyze the electrical properties of the capacitors, inductors on glass substrate. In addition, the comparison of electrical properties of thin-film IPDs on silicon and on glass substrate is given.