Copper Electroplated Grid on CIGS substrates

We present a process sequence for copper electrodeposition on solar cells, originally developed for heterojunction cells with indium tin oxide and adapted to be compatible for solar cells relying on aluminum zinc oxide electrodes. The process comprises a sputtered seed layer and patterning by hotmelt inkjet printing. Well adherent narrow copper lines have been realized on CIGS-AZO-surface and first mini-modules have been realized. Process improvement to fully eliminate attack on AZO and to optimize the grid layout is ongoing.