Demonstration of Non-Lamination Encapsulation Techniques for Thin Film Solar Modules

A new encapsulation architecture for thin film photovoltaics is under development. The motivation for this project is to lower manufacturing costs and improve module reliability. During this project prototype manufacturing processes and equipment have been developed and demonstrated. During the past year, the processing hardware has been commissioned, tested and samples of the new module architecture fabricated. The technology and architecture show great opportunity with each process being demonstrated under 30 seconds and sample modules passing initial accelerated testing.